PCB製品 - 基板クイック試作

All Products アドバンスト基板 HDI PCB Flexible PCB Rigid-flex board スタンダード基板アルミ基板 DFM High-level PCB High frequency and high speed PCB Optical module PCB 5G communication PCB Industrial PCB Semiconductor test PCB Aerospace PCB RF antenna PCB UAV PCB Consumer PCB Medical PCB Auto PCB

7th-order arbitrary interconnection HDI buried/blind via circuit board

The 7th-order HDI board is widely used in high-end smart phones and other fields

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Mobile phone 3rd-order HDI board

12 layers, Material: S1000-2M, Thickness: 1.2±0.1mm

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Automotive communication 2nd-order HDI board

14 layers, Thickness: 1.6±0.16, Surface Finish: OSP

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Industrial control 5th-order HDI board

12 layers, Material: S1000-2M, Thickness: 1.8±0.18m

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Semiconductor test 4th-order HDI board

8 layers, Material: S1000-2M, Thickness: 4.4±0.4mm

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Ipad 3rd-order HDI board

8 layers, Material: S1000-2M, Thickness: 1.2±0.1mm

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10-layer 2nd-order HDI board

10 layers, Material: S1000-2M, Thickness: 1.3±0.13mm

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6th-order arbitrary interconnection HDI buried/blind via circuit board

14 layers, Material: S1000-2M, Thickness: 1.6±0.1mm

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4th-order HDI buried/blind via board

10 layers, Material: S1000-2M, Thickness: 2.2±0.2mm

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3rd-order HDI board

8 layers, Material: A1000-2M, Thickness: 2.5±0.25mm

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3rd-order HDI PCB buried resistor circuit board

8 layers, Material: R5775G+IT180, Thickness: 2.0±0.2mm

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3rd-order 5G IoT HDI PCB

8 layers, Material: S1000-2M, Thickness: 1.0±0.1mm

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2nd-order high speed PCB

18 layers, Material: RO4350B+TU872SLK Rogers, Thickness: 3.2±0.32mm

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2nd-order HDI buried/blind via board

22 layers, Material: TU-883, Thickness: 1.6±0.16mm

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2nd-order HDI test board

10 layers, Material: S1000-2M, Thickness: 1.3±0.13mm

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HDI first-order 8-layer HASL

8 layers, Surface Finish: HASL

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HDI second-order 6-layer immersion gold

6 layers, Surface Finish: immersion gold

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HDI third-order 6-layer immersion gold

6 layers, Surface Finish: immersion gold

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HDI second-order 12-layer immersion gold

12 layers, Surface Finish: immersion gold

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HDI second-order 6-layer laser drilling immersion gold

6 layers, laser drilling immersion gold

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Excellent service, support with file queries, appropriate solutions that facilitate development work. We are very grateful for the attention given to this and other projects manufactured with PCBWay.

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After manufacturing the board correctly, the team contacted me with an assembled prototype to confirm the assembly method. I thought that was amazing. After confirming my part of the assembly, the team proceeded with the production process and assembled the boards in a very professional manner. Congratulations!

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弊社製プリント基板の例

7th-order arbitrary interconnection HDI buried/blind via circuit board

Mobile phone 3rd-order HDI board

Automotive communication 2nd-order HDI board

Industrial control 5th-order HDI board

Semiconductor test 4th-order HDI board

Ipad 3rd-order HDI board

10-layer 2nd-order HDI board

6th-order arbitrary interconnection HDI buried/blind via circuit board

4th-order HDI buried/blind via board

3rd-order HDI board

3rd-order HDI PCB buried resistor circuit board

3rd-order 5G IoT HDI PCB

2nd-order high speed PCB

2nd-order HDI buried/blind via board

2nd-order HDI test board

HDI first-order 8-layer HASL

HDI second-order 6-layer immersion gold

HDI third-order 6-layer immersion gold

HDI second-order 12-layer immersion gold

HDI second-order 6-layer laser drilling immersion gold

基板製造基準

アセンブリ基準