10-layer 2nd-order HDI board

基板製品 / HDI PCB / 10-layer 2nd-order HDI board

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Applications

Test

Features

Ladder board + ENEPIG + bonding

Material

S1000-2M

Layers

10 Layers

Thickness

1.3±0.13mm

Min Hole Size

Laser hole 0.1mm

Min Track/Spacingh

65/65um

Minimum board thickness and hole ratio

12: 1

Surface Finish

Immersion gold(ENIG) 50u"

今すぐお見積もり

製品詳細

10-layer 2nd-order HDI PCB circuit board, the whole board is produced by thick gold plating. It is widely used in chip testing in the field of artificial intelligence and 5G network communication. It is the first choice in the field of artificial intelligence and 5G network communication.

基板製造基準

優品基板のケーパビリティ

多層層圧構造

クイックターン基板製作

基板試作

少量生産

生産工程

基板製品

基板のよくある質問

アセンブリ基準

PCB実装能力

特別なお知らせ

ファイル必要条件

PCBアセンブリFAQ

生産工程

PCBアセンブリ製品

お問い合わせ!

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FENIX v0.5

Excellent service, support with file queries, appropriate solutions that facilitate development work. We are very grateful for the attention given to this and other projects manufactured with PCBWay.

C.A.

Placa de comando

After manufacturing the board correctly, the team contacted me with an assembled prototype to confirm the assembly method. I thought that was amazing. After confirming my part of the assembly, the team proceeded with the production process and assembled the boards in a very professional manner. Congratulations!

Engineer

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