
 
                                            6th-order arbitrary interconnection HDI buried blind via circuit board, the Min Track/Spacing can reach 75um, and the minimum aperture can reach 0.1mm. This type of buried blind via circuit board is widely used in digital cameras, notebooks, mobile phones and other electronic digital products and automotive electronics.
     
The 7th-order HDI board is widely used in high-end smart phones and other fields
12 layers, Material: S1000-2M, Thickness: 1.2±0.1mm
14 layers, Thickness: 1.6±0.16, Surface Finish: OSP
12 layers, Material: S1000-2M, Thickness: 1.8±0.18m
8 layers, Material: S1000-2M, Thickness: 4.4±0.4mm
8 layers, Material: S1000-2M, Thickness: 1.2±0.1mm
10 layers, Material: S1000-2M, Thickness: 1.3±0.13mm
10 layers, Material: S1000-2M, Thickness: 2.2±0.2mm
8 layers, Material: A1000-2M, Thickness: 2.5±0.25mm
8 layers, Material: R5775G+IT180, Thickness: 2.0±0.2mm
8 layers, Material: S1000-2M, Thickness: 1.0±0.1mm
18 layers, Material: RO4350B+TU872SLK Rogers, Thickness: 3.2±0.32mm
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I would like to thank PCBWay for the professionalism and dedication shown in my project. The boards arrived with impeccable quality, precise soldering, and excellent electrical reliability. The entire process, from manufacturing to assembly, was carried out efficiently and in an organized manner. It is great to count on a company that combines cutting-edge technology with attention to detail.
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