6th-order arbitrary interconnection HDI buried/blind via circuit board

基板製品 / HDI PCB / 6th-order arbitrary interconnection HDI buried/blind via circuit board

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Applications

Digital products and automotive electronics

Features

Material

S1000-2M

Layers

14 Layers

Thickness

1.6±0.1mm

Min Hole Size

Laser hole 0.15mm; mechanical hole 0.20mm

Min Track/Spacingh

75/75um

Minimum board thickness and hole ratio

8:1

Surface Finish

Immersion gold(ENIG) 0.05um

今すぐお見積もり

製品詳細

6th-order arbitrary interconnection HDI buried blind via circuit board, the Min Track/Spacing can reach 75um, and the minimum aperture can reach 0.1mm. This type of buried blind via circuit board is widely used in digital cameras, notebooks, mobile phones and other electronic digital products and automotive electronics.

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I just wanted to reach out and say that the quality of this assembly batch is excellent AGAIN. I am especially happy to see that the specific soldering instruction I left for one of the components was followed perfectly. The execution was incredible. Also, the communication regarding the BOM was great and very helpful in ensuring everything went smoothly. I have tested the board, and it works perfectly.

Yordanov

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