基板クイック試作
カスタム基板試作サービス
基板クイック試作
カスタム基板試作サービス
6th-order arbitrary interconnection HDI buried blind via circuit board, the Min Track/Spacing can reach 75um, and the minimum aperture can reach 0.1mm. This type of buried blind via circuit board is widely used in digital cameras, notebooks, mobile phones and other electronic digital products and automotive electronics.
The 7th-order HDI board is widely used in high-end smart phones and other fields
12 layers, Material: S1000-2M, Thickness: 1.2±0.1mm
14 layers, Thickness: 1.6±0.16, Surface Finish: OSP
12 layers, Material: S1000-2M, Thickness: 1.8±0.18m
8 layers, Material: S1000-2M, Thickness: 4.4±0.4mm
8 layers, Material: S1000-2M, Thickness: 1.2±0.1mm
10 layers, Material: S1000-2M, Thickness: 1.3±0.13mm
10 layers, Material: S1000-2M, Thickness: 2.2±0.2mm
8 layers, Material: A1000-2M, Thickness: 2.5±0.25mm
8 layers, Material: R5775G+IT180, Thickness: 2.0±0.2mm
8 layers, Material: S1000-2M, Thickness: 1.0±0.1mm
18 layers, Material: RO4350B+TU872SLK Rogers, Thickness: 3.2±0.32mm
お問い合わせ!
私達のカスタマーサービス+86-571-85317532
Great boards! Even with the basic shipping, I had the boards in hand in New Zealand something like a week after ordering them. Quality is great, exactly as designed. Thanks!
Rees
I had PCBWay do the surface mount soldering so I only had to do the through-hole soldering. They handled all the small SMD parts well, and the board arrived well soldered and very clean.
carswithjoysticks
