基板クイック試作
カスタム基板試作サービス
基板クイック試作
カスタム基板試作サービス
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In the layer structure of a PCB board, there are several important concepts.
PP (Prepreg): Prepreg is a semi-cured sheet, also known as prepreg material, a thin sheet
material that impregnated with resin and cured to an intermediate degree. It is mainly used as
the bonding material and insulation material for inner conductive patterns of multilayer printed
circuit boards. After being laminated with Prepreg, the semi-cured epoxy resin is squeezed out,
begins to flow, and solidifies, bonding the multilayer circuit boards together and forming a
reliable insulating layer. In the PCB industry, Prepreg can be likened to glue, used to bond
several cores together using the lamination method to create multilayer boards.
PP Type:1080(3.1mil), 3313(4.2mil), 2116(5.4mil), 7628(7.7mil).
Core: Core is a rigid material with specific thickness and copper on both sides.
The pressing materials for multilayer boards mainly consist of Prepreg and Core.
The differences between the two are:
- Prepreg is a material used in PCBs, with a semi-solid texture similar to cardboard, while core
is a rigid material similar to copper.
- Prepreg functions as both an adhesive and insulator, whereas core serves as the foundational
material for PCBs, with entirely different functional roles.
- Prepreg can be flexible, while core cannot be bent.
- Prepreg is non-conductive, whereas core has copper layers on both sides, serving as the
conductive medium for the printed circuit board.
In other special cases or Advanced PCBs (you need to choose "Customized Services and Advanced
Options" and Custom stackup or Impedance control):
1. If you need custom stackup or control impedance, we will manufacture according to your
requirement.
2. After place order,we will calculate whether it meets the requirements based on the stackup ,
material and impedance information.Also we will confirm with you.
For flexible PCB stackup, please check "Stack-up for FPC".
For rigid PCB, in response to customer demand, PCBWay has added a variety of laminate structures
to our products (currently, we have added 298 and will continue to update them), which
can greatly satisfy product structural design and impedance requirements.
お問い合わせ!
私達のカスタマーサービス+86-571-85317532
Everything is done qualitatively and on time, delivery is fast. All satisfied, ordered already the third time - incomparable! I recommend this service to everyone. Special thanks to the developer of the board, the author under the nickname Miron63.
havroshka
As always PCBWay has delivered a perfectly functional board with their easy upload quote tool for production and assembly. This project was a custom power board for providing power with either a USB C power cable, or 4 NiMH AA batteries over an XH-3 connector to a custom Arduino board based on the ATtiny 1614 that I made for a Custom 3D printed MTG Deck Case design that I have been working on. As usual the staff at PCB way have been very responsive and professional and I am very satisfied with the end product, making my Hobby level board design look and feel very professional. Big thanks to everyone at PCBWay that makes it all possible!
LeBlanc
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1855 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
1.1
(Core with Cu) |
| CORE |
Core DK:4.6 |
1.0300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1855 |
| L4-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
Thickness after lamination: 1.51mm, tolerance: ±10%
Finished PCB Thickness: 1.61mm, tolerance: ±10%
Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1785 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
1.1
(Core with Cu) |
| CORE |
Core DK:4.6 |
1.0300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1785 |
| L4-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
Thickness after lamination: 1.49mm, tolerance: ±10%
Finished PCB Thickness: 1.59mm, tolerance: ±10%
40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1715 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
1.1
(Core with Cu) |
| CORE |
Core DK:4.6 |
1.0300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1715 |
| L4-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
Thickness after lamination: 1.48mm, tolerance: ±10%
Finished PCB Thickness: 1.58mm, tolerance: ±10%
Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1855 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
1.0
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.9300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1855 |
| L4-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
Thickness after lamination: 1.48mm, tolerance: ±10%
Finished PCB Thickness: 1.58mm, tolerance: ±10%
Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1785 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
1.0
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.9300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1785 |
| L4-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
Thickness after lamination: 1.46mm, tolerance: ±10%
Finished PCB Thickness: 1.56mm, tolerance: ±10%
40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1715 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
1.0
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.9300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1715 |
| L4-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
Thickness after lamination: 1.45mm, tolerance: ±10%
Finished PCB Thickness: 1.55mm, tolerance: ±10%
Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1803 |
| L2-CU | Inner Copper 1.5OZ | 0.0525 |
1.0
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.8950 | |
| L3-CU | Inner Copper 1.5OZ | 0.0525 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1803 |
| L4-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
Thickness after lamination: 1.47mm, tolerance: ±10%
Finished PCB Thickness: 1.57mm, tolerance: ±10%
Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
| PP |
2116 RC58% DK:4.45 |
0.1300 | 0.1195 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
2.0
(Core with Cu) |
| CORE |
Core DK:4.6 |
1.9300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
2116 RC58% DK:4.45 |
0.1300 | 0.1195 |
| L4-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
Thickness after lamination: 2.27mm, tolerance: ±10%
Finished PCB Thickness: 2.37mm, tolerance: ±10%
Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1785 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
1.94
(Core with Cu) |
| CORE |
Core DK:4.6 |
1.8700 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1785 |
| L4-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
Thickness after lamination: 2.33mm, tolerance: ±10%
Finished PCB Thickness: 2.43mm, tolerance: ±10%
40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1715 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
1.94
(Core with Cu) |
| CORE |
Core DK:4.6 |
1.8700 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1715 |
| L4-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
Thickness after lamination: 2.32mm, tolerance: ±10%
Finished PCB Thickness: 2.42mm, tolerance: ±10%
Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
| PP |
2116 RC58% DK:4.45 |
0.1300 | 0.1195 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
1.6
(Core with Cu) |
| CORE |
Core DK:4.6 |
1.5300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
2116 RC58% DK:4.45 |
0.1300 | 0.1195 |
| L4-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
Thickness after lamination: 1.87mm, tolerance: ±10%
Finished PCB Thickness: 1.97mm, tolerance: ±10%
Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
| PP |
2116 RC58% DK:4.45 |
0.1300 | 0.1125 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
1.6
(Core with Cu) |
| CORE |
Core DK:4.6 |
1.5300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
2116 RC58% DK:4.45 |
0.1300 | 0.1125 |
| L4-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
Thickness after lamination: 1.86mm, tolerance: ±10%
Finished PCB Thickness: 1.96mm, tolerance: ±10%
40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1715 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
1.5
(Core with Cu) |
| CORE |
Core DK:4.6 |
1.4300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1715 |
| L4-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
Thickness after lamination: 1.88mm, tolerance: ±10%
Finished PCB Thickness: 1.98mm, tolerance: ±10%
Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
| PP |
2116 RC58% DK:4.45 |
0.1300 | 0.1195 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
1.6
(Core with Cu) |
| CORE |
Core DK:4.6 |
1.5300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
2116 RC58% DK:4.45 |
0.1300 | 0.1195 |
| L4-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
Thickness after lamination: 1.94mm, tolerance: ±10%
Finished PCB Thickness: 2.04mm, tolerance: ±10%
Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
| PP |
2116 RC58% DK:4.45 |
0.1300 | 0.1125 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
1.6
(Core with Cu) |
| CORE |
Core DK:4.6 |
1.5300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
2116 RC58% DK:4.45 |
0.1300 | 0.1125 |
| L4-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
Thickness after lamination: 1.93mm, tolerance: ±10%
Finished PCB Thickness: 2.03mm, tolerance: ±10%
40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1715 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
1.5
(Core with Cu) |
| CORE |
Core DK:4.6 |
1.4300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1715 |
| L4-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
Thickness after lamination: 1.95mm, tolerance: ±10%
Finished PCB Thickness: 2.05mm, tolerance: ±10%
Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1855 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
0.7
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.6300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1855 |
| L4-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
Thickness after lamination: 1.11mm, tolerance: ±10%
Finished PCB Thickness: 1.21mm, tolerance: ±10%
Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1785 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
0.7
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.6300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1785 |
| L4-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
Thickness after lamination: 1.09mm, tolerance: ±10%
Finished PCB Thickness: 1.19mm, tolerance: ±10%
40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1715 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
0.7
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.6300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1715 |
| L4-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
Thickness after lamination: 1.08mm, tolerance: ±10%
Finished PCB Thickness: 1.18mm, tolerance: ±10%
Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
| PP |
2116 RC58% DK:4.45 |
0.1300 | 0.1195 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
0.8
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.7300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
2116 RC58% DK:4.45 |
0.1300 | 0.1195 |
| L4-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
Thickness after lamination: 1.14mm, tolerance: ±10%
Finished PCB Thickness: 1.24mm, tolerance: ±10%
Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1785 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
0.7
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.6300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1785 |
| L4-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
Thickness after lamination: 1.16mm, tolerance: ±10%
Finished PCB Thickness: 1.26mm, tolerance: ±10%
40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1715 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
0.7
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.6300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1715 |
| L4-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
Thickness after lamination: 1.15mm, tolerance: ±10%
Finished PCB Thickness: 1.25mm, tolerance: ±10%
Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1855 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
0.5
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.4300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1855 |
| L4-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
Thickness after lamination: 0.91mm, tolerance: ±10%
Finished PCB Thickness: 1.01mm, tolerance: ±10%
Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1785 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
0.5
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.4300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1785 |
| L4-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
Thickness after lamination: 0.89mm, tolerance: ±10%
Finished PCB Thickness: 0.99mm, tolerance: ±10%
40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1715 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
0.5
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.4300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1715 |
| L4-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
Thickness after lamination: 0.88mm, tolerance: ±10%
Finished PCB Thickness: 0.98mm, tolerance: ±10%
Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
| PP |
3313 RC58% DK:4.45 |
0.1030 | 0.0925 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
0.6
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.5300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
3313 RC58% DK:4.45 |
0.1030 | 0.0925 |
| L4-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
Thickness after lamination: 0.89mm, tolerance: ±10%
Finished PCB Thickness: 0.99mm, tolerance: ±10%
Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
| PP |
2116 RC58% DK:4.45 |
0.1300 | 0.1125 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
0.6
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.5300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
2116 RC58% DK:4.45 |
0.1300 | 0.1125 |
| L4-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
Thickness after lamination: 0.93mm, tolerance: ±10%
Finished PCB Thickness: 1.03mm, tolerance: ±10%
40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
| PP |
2116 RC58% DK:4.45 |
0.1300 | 0.1055 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
0.6
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.5300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
2116 RC58% DK:4.45 |
0.1300 | 0.1055 |
| L4-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
Thickness after lamination: 0.92mm, tolerance: ±10%
Finished PCB Thickness: 1.02mm, tolerance: ±10%
Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1855 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
0.3
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.2300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1855 |
| L4-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
Thickness after lamination: 0.71mm, tolerance: ±10%
Finished PCB Thickness: 0.81mm, tolerance: ±10%
Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1785 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
0.3
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.2300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1785 |
| L4-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
Thickness after lamination: 0.69mm, tolerance: ±10%
Finished PCB Thickness: 0.79mm, tolerance: ±10%
40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1715 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
0.3
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.2300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1715 |
| L4-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
Thickness after lamination: 0.68mm, tolerance: ±10%
Finished PCB Thickness: 0.78mm, tolerance: ±10%
Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 2OZ) |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1855 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
0.3
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.2300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1855 |
| L4-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 2OZ) |
Thickness after lamination: 0.71mm, tolerance: ±10%
Finished PCB Thickness: 0.81mm, tolerance: ±10%
Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 2OZ) |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1785 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
0.3
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.2300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1785 |
| L4-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 2OZ) |
Thickness after lamination: 0.69mm, tolerance: ±10%
Finished PCB Thickness: 0.79mm, tolerance: ±10%
40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 2OZ) |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1715 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
0.3
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.2300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.1715 |
| L4-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 2OZ) |
Thickness after lamination: 0.68mm, tolerance: ±10%
Finished PCB Thickness: 0.78mm, tolerance: ±10%
Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
| PP |
3313 RC58% DK:4.45 |
0.1030 | 0.0925 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
0.3
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.2300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
3313 RC58% DK:4.45 |
0.1030 | 0.0925 |
| L4-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
Thickness after lamination: 0.52mm, tolerance: ±10%
Finished PCB Thickness: 0.62mm, tolerance: ±10%
Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
| PP |
3313 RC58% DK:4.45 |
0.1030 | 0.0855 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
0.3
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.2300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
3313 RC58% DK:4.45 |
0.1030 | 0.0855 |
| L4-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
Thickness after lamination: 0.51mm, tolerance: ±10%
Finished PCB Thickness: 0.61mm, tolerance: ±10%
40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
| PP |
3313 RC58% DK:4.45 |
0.1030 | 0.0925 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
0.2
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.1300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
3313 RC58% DK:4.45 |
0.1030 | 0.0925 |
| L4-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
Thickness after lamination: 0.49mm, tolerance: ±10%
Finished PCB Thickness: 0.59mm, tolerance: ±10%
Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
| PP |
2116 RC58% DK:4.45 |
0.1300 | 0.1125 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
0.2
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.1300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
2116 RC58% DK:4.45 |
0.1300 | 0.1125 |
| L4-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
Thickness after lamination: 0.53mm, tolerance: ±10%
Finished PCB Thickness: 0.63mm, tolerance: ±10%
40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
| PP |
2116 RC58% DK:4.45 |
0.1300 | 0.1055 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
0.2
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.1300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
2116 RC58% DK:4.45 |
0.1300 | 0.1055 |
| L4-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
Thickness after lamination: 0.52mm, tolerance: ±10%
Finished PCB Thickness: 0.62mm, tolerance: ±10%
Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
| PP |
1080 RC68% DK:4.21 |
0.0810 | 0.0705 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
0.135
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.0650 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
1080 RC68% DK:4.21 |
0.0810 | 0.0705 |
| L4-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
Thickness after lamination: 0.31mm, tolerance: ±10%
Finished PCB Thickness: 0.41mm, tolerance: ±10%
Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
| PP |
1080 RC68% DK:4.21 |
0.0810 | 0.0635 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
0.135
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.0650 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
1080 RC68% DK:4.21 |
0.0810 | 0.0635 |
| L4-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
Thickness after lamination: 0.3mm, tolerance: ±10%
Finished PCB Thickness: 0.40mm, tolerance: ±10%
40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
| PP |
1080 RC68% DK:4.21 |
0.0810 | 0.0565 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
0.135
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.0650 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
1080 RC68% DK:4.21 |
0.0810 | 0.0565 |
| L4-CU | Outer Base Copper 0.5OZ | 0.0175 |
0.0175
(Plating to 1OZ) |
Thickness after lamination: 0.28mm, tolerance: ±10%
Finished PCB Thickness: 0.38mm, tolerance: ±10%
Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 1.5OZ | 0.0265 |
0.0265
(Plating to 2OZ) |
| PP |
2116 RC58% DK:4.45 |
0.1300 | 0.1125 |
| L2-CU | Inner Copper 1OZ | 0.0350 |
2.0
(Core with Cu) |
| CORE |
Core DK:4.6 |
1.9300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
2116 RC58% DK:4.45 |
0.1300 | 0.1125 |
| L4-CU | Outer Base Copper 1.5OZ | 0.0265 |
0.0265
(Plating to 2OZ) |
Thickness after lamination: 2.28mm, tolerance: ±10%
Finished PCB Thickness: 2.38mm, tolerance: ±10%
40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
| PP |
2116 RC58% DK:4.45 |
0.1300 | 0.2338 |
| PP |
2116 RC58% DK:4.45 |
0.1300 | |
| L2-CU | Inner Copper 1.5OZ | 0.0525 |
0.9
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.7950 | |
| L3-CU | Inner Copper 1.5OZ | 0.0525 | |
| PP |
2116 RC58% DK:4.45 |
0.1300 | 0.2338 |
| PP |
2116 RC58% DK:4.45 |
0.1300 | |
| L4-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
Thickness after lamination: 1.47mm, tolerance: ±10%
Finished PCB Thickness: 1.57mm, tolerance: ±10%
40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
| PP |
1080 RC68% DK:4.21 |
0.0810 | 0.2403 |
| PP |
7628 RC46% DK:4.74 |
0.1960 | |
| L2-CU | Inner Copper 1.5OZ | 0.0525 |
0.9
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.7950 | |
| L3-CU | Inner Copper 1.5OZ | 0.0525 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.2403 |
| PP |
1080 RC68% DK:4.21 |
0.0810 | |
| L4-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
Thickness after lamination: 1.49mm, tolerance: ±10%
Finished PCB Thickness: 1.59mm, tolerance: ±10%
Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
| PP |
2116 RC58% DK:4.45 |
0.1300 | 0.3050 |
| PP |
7628 RC46% DK:4.74 |
0.1960 | |
| L2-CU | Inner Copper 2OZ | 0.0700 |
0.77
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.6300 | |
| L3-CU | Inner Copper 2OZ | 0.0700 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.3050 |
| PP |
2116 RC58% DK:4.45 |
0.1300 | |
| L4-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
Thickness after lamination: 1.49mm, tolerance: ±10%
Finished PCB Thickness: 1.59mm, tolerance: ±10%
Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
| PP |
2116 RC58% DK:4.45 |
0.1300 | 0.2910 |
| PP |
7628 RC46% DK:4.74 |
0.1960 | |
| L2-CU | Inner Copper 2OZ | 0.0700 |
0.77
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.6300 | |
| L3-CU | Inner Copper 2OZ | 0.0700 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.2910 |
| PP |
2116 RC58% DK:4.45 |
0.1300 | |
| L4-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
Thickness after lamination: 1.46mm, tolerance: ±10%
Finished PCB Thickness: 1.56mm, tolerance: ±10%
40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.3430 |
| PP |
7628 RC46% DK:4.74 |
0.1960 | |
| L2-CU | Inner Copper 2OZ | 0.0700 |
0.77
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.6300 | |
| L3-CU | Inner Copper 2OZ | 0.0700 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.3430 |
| PP |
7628 RC46% DK:4.74 |
0.1960 | |
| L4-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
Thickness after lamination: 1.56mm, tolerance: ±10%
Finished PCB Thickness: 1.66mm, tolerance: ±10%
Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 2.5OZ | 0.0875 |
0.0875
(Plating to 3OZ) |
| PP |
2116 RC58% DK:4.45 |
0.1300 | 0.2495 |
| PP |
2116 RC58% DK:4.45 |
0.1300 | |
| L2-CU | Inner Copper 3OZ | 0.1050 |
0.8
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.5900 | |
| L3-CU | Inner Copper 3OZ | 0.1050 | |
| PP |
2116 RC58% DK:4.45 |
0.1300 | 0.2495 |
| PP |
2116 RC58% DK:4.45 |
0.1300 | |
| L4-CU | Outer Base Copper 2.5OZ | 0.0875 |
0.0875
(Plating to 3OZ) |
Thickness after lamination: 1.47mm, tolerance: ±10%
Finished PCB Thickness: 1.57mm, tolerance: ±10%
Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 2.5OZ | 0.0875 |
0.0875
(Plating to 3OZ) |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.3815 |
| PP |
7628 RC46% DK:4.74 |
0.1960 | |
| L2-CU | Inner Copper 3OZ | 0.1050 |
0.55
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.3400 | |
| L3-CU | Inner Copper 3OZ | 0.1050 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.3815 |
| PP |
7628 RC46% DK:4.74 |
0.1960 | |
| L4-CU | Outer Base Copper 2.5OZ | 0.0875 |
0.0875
(Plating to 3OZ) |
Thickness after lamination: 1.49mm, tolerance: ±10%
Finished PCB Thickness: 1.59mm, tolerance: ±10%
Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 2.5OZ | 0.0875 |
0.0875
(Plating to 3OZ) |
| PP |
2116 RC58% DK:4.45 |
0.1300 | 0.3155 |
| PP |
7628 RC46% DK:4.74 |
0.1960 | |
| L2-CU | Inner Copper 3OZ | 0.1050 |
0.68
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.4700 | |
| L3-CU | Inner Copper 3OZ | 0.1050 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.3155 |
| PP |
2116 RC58% DK:4.45 |
0.1300 | |
| L4-CU | Outer Base Copper 2.5OZ | 0.0875 |
0.0875
(Plating to 3OZ) |
Thickness after lamination: 1.49mm, tolerance: ±10%
Finished PCB Thickness: 1.59mm, tolerance: ±10%
Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 3.5OZ | 0.1225 |
0.1225
(Plating to 4OZ) |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.3780 |
| PP |
7628 RC46% DK:4.74 |
0.1960 | |
| L2-CU | Inner Copper 4OZ | 0.1400 |
0.51
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.2300 | |
| L3-CU | Inner Copper 4OZ | 0.1400 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.3780 |
| PP |
7628 RC46% DK:4.74 |
0.1960 | |
| L4-CU | Outer Base Copper 3.5OZ | 0.1225 |
0.1225
(Plating to 4OZ) |
Thickness after lamination: 1.51mm, tolerance: ±10%
Finished PCB Thickness: 1.61mm, tolerance: ±10%
Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 3.5OZ | 0.1225 |
0.1225
(Plating to 4OZ) |
| PP |
3313 RC58% DK:4.45 |
0.1030 | 0.2190 |
| PP |
2116 RC58% DK:4.45 |
0.1300 | |
| L2-CU | Inner Copper 4OZ | 0.1400 |
0.80
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.5200 | |
| L3-CU | Inner Copper 4OZ | 0.1400 | |
| PP |
2116 RC58% DK:4.45 |
0.1300 | 0.2190 |
| PP |
3313 RC58% DK:4.45 |
0.1030 | |
| L4-CU | Outer Base Copper 3.5OZ | 0.1225 |
0.1225
(Plating to 4OZ) |
Thickness after lamination: 1.48mm, tolerance: ±10%
Finished PCB Thickness: 1.58mm, tolerance: ±10%
Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 3.5OZ | 0.1225 |
0.1225
(Plating to 4OZ) |
| PP |
2116 RC58% DK:4.45 |
0.1300 | 0.3120 |
| PP |
7628 RC46% DK:4.74 |
0.1960 | |
| L2-CU | Inner Copper 4OZ | 0.1400 |
0.60
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.3200 | |
| L3-CU | Inner Copper 4OZ | 0.1400 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.3120 |
| PP |
2116 RC58% DK:4.45 |
0.1300 | |
| L4-CU | Outer Base Copper 3.5OZ | 0.1225 |
0.1225
(Plating to 4OZ) |
Thickness after lamination: 1.47mm, tolerance: ±10%
Finished PCB Thickness: 1.57mm, tolerance: ±10%
Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 3.5OZ | 0.1225 |
0.1225
(Plating to 5OZ) |
| PP |
3313 RC58% DK:4.45 |
0.1070 | 0.2855 |
| PP |
7628 RC46% DK:4.74 |
0.1960 | |
| L2-CU | Inner Copper 5OZ | 0.1750 |
0.67
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.3200 | |
| L3-CU | Inner Copper 5OZ | 0.1750 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.2855 |
| PP |
3313 RC58% DK:4.45 |
0.1070 | |
| L4-CU | Outer Base Copper 3.5OZ | 0.1225 |
0.1225
(Plating to 5OZ) |
Thickness after lamination: 1.49mm, tolerance: ±10%
Finished PCB Thickness: 1.59mm, tolerance: ±10%
Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 3.5OZ | 0.1225 |
0.1225
(Plating to 5OZ) |
| PP |
3313 RC58% DK:4.45 |
0.1070 | 0.2265 |
| PP |
2116 RC58% DK:4.45 |
0.1370 | |
| L2-CU | Inner Copper 5OZ | 0.1750 |
0.80
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.4500 | |
| L3-CU | Inner Copper 5OZ | 0.1750 | |
| PP |
2116 RC58% DK:4.45 |
0.1370 | 0.2265 |
| PP |
3313 RC58% DK:4.45 |
0.1070 | |
| L4-CU | Outer Base Copper 3.5OZ | 0.1225 |
0.1225
(Plating to 5OZ) |
Thickness after lamination: 1.5mm, tolerance: ±10%
Finished PCB Thickness: 1.60mm, tolerance: ±10%
Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 3.5OZ | 0.1225 |
0.1225
(Plating to 5OZ) |
| PP |
3313 RC58% DK:4.45 |
0.1070 | 0.2855 |
| PP |
7628 RC46% DK:4.74 |
0.1960 | |
| L2-CU | Inner Copper 5OZ | 0.1750 |
0.67
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.3200 | |
| L3-CU | Inner Copper 5OZ | 0.1750 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.2855 |
| PP |
3313 RC58% DK:4.45 |
0.1070 | |
| L4-CU | Outer Base Copper 3.5OZ | 0.1225 |
0.1225
(Plating to 5OZ) |
Thickness after lamination: 1.49mm, tolerance: ±10%
Finished PCB Thickness: 1.59mm, tolerance: ±10%
Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 1.5OZ | 0.0520 |
0.0520
(Plating to 2OZ) |
| PP |
3313 RC58% DK:4.45 |
0.1030 | 0.2885 |
| PP |
7628 RC46% DK:4.74 |
0.1960 | |
| L2-CU | Inner Copper 1OZ | 0.0350 |
1.6
(Core with Cu) |
| CORE |
Core DK:4.6 |
1.5300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.2885 |
| PP |
3313 RC58% DK:4.45 |
0.1030 | |
| L4-CU | Outer Base Copper 1.5OZ | 0.0520 |
0.0520
(Plating to 2OZ) |
Thickness after lamination: 2.28mm, tolerance: ±10%
Finished PCB Thickness: 2.38mm, tolerance: ±10%
Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 1.5OZ | 0.0520 |
0.0520
(Plating to 2OZ) |
| PP |
2116 RC58% DK:4.45 |
0.1300 | 0.3085 |
| PP |
7628 RC46% DK:4.74 |
0.1960 | |
| L2-CU | Inner Copper 1OZ | 0.0350 |
1.6
(Core with Cu) |
| CORE |
Core DK:4.6 |
1.5300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.3085 |
| PP |
2116 RC58% DK:4.45 |
0.1300 | |
| L4-CU | Outer Base Copper 1.5OZ | 0.0520 |
0.0520
(Plating to 2OZ) |
Thickness after lamination: 2.32mm, tolerance: ±10%
Finished PCB Thickness: 2.42mm, tolerance: ±10%
40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 1.5OZ | 0.0520 |
0.0520
(Plating to 2OZ) |
| PP |
2116 RC58% DK:4.45 |
0.1300 | 0.3015 |
| PP |
7628 RC46% DK:4.74 |
0.1960 | |
| L2-CU | Inner Copper 1OZ | 0.0350 |
1.6
(Core with Cu) |
| CORE |
Core DK:4.6 |
1.5300 | |
| L3-CU | Inner Copper 1OZ | 0.0350 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.3015 |
| PP |
2116 RC58% DK:4.45 |
0.1300 | |
| L4-CU | Outer Base Copper 1.5OZ | 0.0520 |
0.0520
(Plating to 2OZ) |
Thickness after lamination: 2.31mm, tolerance: ±10%
Finished PCB Thickness: 2.41mm, tolerance: ±10%
Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 1.5OZ | 0.0520 |
0.0520
(Plating to 2OZ) |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.3763 |
| PP |
7628 RC46% DK:4.74 |
0.1960 | |
| L2-CU | Inner Copper 1.5OZ | 0.0525 |
1.5
(Core with Cu) |
| CORE |
Core DK:4.6 |
1.3950 | |
| L3-CU | Inner Copper 1.5OZ | 0.0525 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.3763 |
| PP |
7628 RC46% DK:4.74 |
0.1960 | |
| L4-CU | Outer Base Copper 1.5OZ | 0.0520 |
0.0520
(Plating to 2OZ) |
Thickness after lamination: 2.36mm, tolerance: ±10%
Finished PCB Thickness: 2.46mm, tolerance: ±10%
Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 1.5OZ | 0.0520 |
0.0520
(Plating to 2OZ) |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.3658 |
| PP |
7628 RC46% DK:4.74 |
0.1960 | |
| L2-CU | Inner Copper 1.5OZ | 0.0525 |
1.5
(Core with Cu) |
| CORE |
Core DK:4.6 |
1.3950 | |
| L3-CU | Inner Copper 1.5OZ | 0.0525 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.3658 |
| PP |
7628 RC46% DK:4.74 |
0.1960 | |
| L4-CU | Outer Base Copper 1.5OZ | 0.0520 |
0.0520
(Plating to 2OZ) |
Thickness after lamination: 2.34mm, tolerance: ±10%
Finished PCB Thickness: 2.44mm, tolerance: ±10%
40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 1.5OZ | 0.0520 |
0.0520
(Plating to 2OZ) |
| PP |
2116 RC58% DK:4.45 |
0.1300 | 0.2893 |
| PP |
7628 RC46% DK:4.74 |
0.1960 | |
| L2-CU | Inner Copper 1.5OZ | 0.0525 |
1.64
(Core with Cu) |
| CORE |
Core DK:4.6 |
1.5350 | |
| L3-CU | Inner Copper 1.5OZ | 0.0525 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.2893 |
| PP |
2116 RC58% DK:4.45 |
0.1300 | |
| L4-CU | Outer Base Copper 1.5OZ | 0.0520 |
0.0520
(Plating to 2OZ) |
Thickness after lamination: 2.32mm, tolerance: ±10%
Finished PCB Thickness: 2.42mm, tolerance: ±10%
Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 1.5OZ | 0.0520 |
0.0520
(Plating to 2OZ) |
| PP |
1080 RC68% DK:4.21 |
0.0810 | 0.3370 |
| PP |
1080 RC68% DK:4.21 |
0.0810 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | |
| L2-CU | Inner Copper 2OZ | 0.0700 |
1.54
(Core with Cu) |
| CORE |
Core DK:4.6 |
1.4000 | |
| L3-CU | Inner Copper 2OZ | 0.0700 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.3370 |
| PP |
1080 RC68% DK:4.21 |
0.0810 | |
| PP |
1080 RC68% DK:4.21 |
0.0810 | |
| L4-CU | Outer Base Copper 1.5OZ | 0.0520 |
0.0520
(Plating to 2OZ) |
Thickness after lamination: 2.32mm, tolerance: ±10%
Finished PCB Thickness: 2.41mm, tolerance: ±10%
Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 1.5OZ | 0.0520 |
0.0520
(Plating to 2OZ) |
| PP |
3313 RC58% DK:4.45 |
0.1030 | 0.2640 |
| PP |
7628 RC46% DK:4.74 |
0.1960 | |
| L2-CU | Inner Copper 2OZ | 0.0700 |
1.67
(Core with Cu) |
| CORE |
Core DK:4.6 |
1.5300 | |
| L3-CU | Inner Copper 2OZ | 0.0700 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.2640 |
| PP |
3313 RC58% DK:4.45 |
0.1030 | |
| L4-CU | Outer Base Copper 1.5OZ | 0.0520 |
0.0520
(Plating to 2OZ) |
Thickness after lamination: 2.3mm, tolerance: ±10%
Finished PCB Thickness: 2.40mm, tolerance: ±10%
40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 1.5OZ | 0.0520 |
0.0520
(Plating to 2OZ) |
| PP |
1080 RC68% DK:4.21 |
0.0810 | 0.3090 |
| PP |
1080 RC68% DK:4.21 |
0.0810 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | |
| L2-CU | Inner Copper 2OZ | 0.0700 |
1.57
(Core with Cu) |
| CORE |
Core DK:4.6 |
1.4300 | |
| L3-CU | Inner Copper 2OZ | 0.0700 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.3090 |
| PP |
1080 RC68% DK:4.21 |
0.0810 | |
| PP |
1080 RC68% DK:4.21 |
0.0810 | |
| L4-CU | Outer Base Copper 1.5OZ | 0.0520 |
0.0520
(Plating to 2OZ) |
Thickness after lamination: 2.29mm, tolerance: ±10%
Finished PCB Thickness: 2.39mm, tolerance: ±10%
Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 2.5OZ | 0.0875 |
0.0875
(Plating to 3OZ) |
| PP |
1080 RC68% DK:4.21 |
0.0810 | 0.2665 |
| PP |
7628 RC46% DK:4.74 |
0.1960 | |
| L2-CU | Inner Copper 3OZ | 0.1050 |
1.6
(Core with Cu) |
| CORE |
Core DK:4.6 |
1.3900 | |
| L3-CU | Inner Copper 3OZ | 0.1050 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.2665 |
| PP |
1080 RC68% DK:4.21 |
0.0810 | |
| L4-CU | Outer Base Copper 2.5OZ | 0.0875 |
0.0875
(Plating to 3OZ) |
Thickness after lamination: 2.31mm, tolerance: ±10%
Finished PCB Thickness: 2.41mm, tolerance: ±10%
Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 2.5OZ | 0.0875 |
0.0875
(Plating to 3OZ) |
| PP |
1080 RC68% DK:4.21 |
0.0810 | 0.2005 |
| PP |
2116 RC58% DK:4.45 |
0.1300 | |
| L2-CU | Inner Copper 3OZ | 0.1050 |
1.73
(Core with Cu) |
| CORE |
Core DK:4.6 |
1.5200 | |
| L3-CU | Inner Copper 3OZ | 0.1050 | |
| PP |
2116 RC58% DK:4.45 |
0.1300 | 0.2005 |
| PP |
1080 RC68% DK:4.21 |
0.0810 | |
| L4-CU | Outer Base Copper 2.5OZ | 0.0875 |
0.0875
(Plating to 3OZ) |
Thickness after lamination: 2.31mm, tolerance: ±10%
Finished PCB Thickness: 2.41mm, tolerance: ±10%
Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 3.5OZ | 0.1225 |
0.1225
(Plating to 4OZ) |
| PP |
3313 RC58% DK:4.45 |
0.1030 | 0.2850 |
| PP |
7628 RC46% DK:4.74 |
0.1960 | |
| L2-CU | Inner Copper 4OZ | 0.1400 |
1.5
(Core with Cu) |
| CORE |
Core DK:4.6 |
1.2200 | |
| L3-CU | Inner Copper 4OZ | 0.1400 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.2850 |
| PP |
3313 RC58% DK:4.45 |
0.1030 | |
| L4-CU | Outer Base Copper 3.5OZ | 0.1225 |
0.1225
(Plating to 4OZ) |
Thickness after lamination: 2.32mm, tolerance: ±10%
Finished PCB Thickness: 2.42mm, tolerance: ±10%
Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 3.5OZ | 0.1225 |
0.1225
(Plating to 4OZ) |
| PP |
1080 RC68% DK:4.21 |
0.0810 | 0.2630 |
| PP |
7628 RC46% DK:4.74 |
0.1960 | |
| L2-CU | Inner Copper 4OZ | 0.1400 |
1.54
(Core with Cu) |
| CORE |
Core DK:4.6 |
1.2600 | |
| L3-CU | Inner Copper 4OZ | 0.1400 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.2630 |
| PP |
1080 RC68% DK:4.21 |
0.0810 | |
| L4-CU | Outer Base Copper 3.5OZ | 0.1225 |
0.1225
(Plating to 4OZ) |
Thickness after lamination: 2.31mm, tolerance: ±10%
Finished PCB Thickness: 2.41mm, tolerance: ±10%
Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 3.5OZ | 0.1225 |
0.1225
(Plating to 5OZ) |
| PP |
1080 RC68% DK:4.21 |
0.0810 | 0.2595 |
| PP |
7628 RC46% DK:4.74 |
0.1960 | |
| L2-CU | Inner Copper 5OZ | 0.1750 |
1.54
(Core with Cu) |
| CORE |
Core DK:4.6 |
1.1900 | |
| L3-CU | Inner Copper 5OZ | 0.1750 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.2595 |
| PP |
1080 RC68% DK:4.21 |
0.0810 | |
| L4-CU | Outer Base Copper 3.5OZ | 0.1225 |
0.1225
(Plating to 5OZ) |
Thickness after lamination: 2.3mm, tolerance: ±10%
Finished PCB Thickness: 2.40mm, tolerance: ±10%
Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 3.5OZ | 0.1225 |
0.1225
(Plating to 5OZ) |
| PP |
1080 RC68% DK:4.21 |
0.0810 | 0.2595 |
| PP |
7628 RC46% DK:4.74 |
0.1960 | |
| L2-CU | Inner Copper 5OZ | 0.1750 |
1.54
(Core with Cu) |
| CORE |
Core DK:4.6 |
1.1900 | |
| L3-CU | Inner Copper 5OZ | 0.1750 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.2595 |
| PP |
1080 RC68% DK:4.21 |
0.0810 | |
| L4-CU | Outer Base Copper 3.5OZ | 0.1225 |
0.1225
(Plating to 5OZ) |
Thickness after lamination: 2.3mm, tolerance: ±10%
Finished PCB Thickness: 2.40mm, tolerance: ±10%
Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.3763 |
| PP |
7628 RC46% DK:4.74 |
0.1960 | |
| L2-CU | Inner Copper 1.5OZ | 0.0525 |
1.1
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.9950 | |
| L3-CU | Inner Copper 1.5OZ | 0.0525 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.3763 |
| PP |
7628 RC46% DK:4.74 |
0.1960 | |
| L4-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
Thickness after lamination: 1.96mm, tolerance: ±10%
Finished PCB Thickness: 2.06mm, tolerance: ±10%
Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.3658 |
| PP |
7628 RC46% DK:4.74 |
0.1960 | |
| L2-CU | Inner Copper 1.5OZ | 0.0525 |
1.1
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.9950 | |
| L3-CU | Inner Copper 1.5OZ | 0.0525 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.3658 |
| PP |
7628 RC46% DK:4.74 |
0.1960 | |
| L4-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
Thickness after lamination: 1.94mm, tolerance: ±10%
Finished PCB Thickness: 2.04mm, tolerance: ±10%
40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.3553 |
| PP |
7628 RC46% DK:4.74 |
0.1960 | |
| L2-CU | Inner Copper 1.5OZ | 0.0525 |
1.1
(Core with Cu) |
| CORE |
Core DK:4.6 |
0.9950 | |
| L3-CU | Inner Copper 1.5OZ | 0.0525 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.3553 |
| PP |
7628 RC46% DK:4.74 |
0.1960 | |
| L4-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
Thickness after lamination: 1.92mm, tolerance: ±10%
Finished PCB Thickness: 2.02mm, tolerance: ±10%
Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.
| Layer | Material |
Thickness (mm) |
Thickness after lamination(mm) |
|---|---|---|---|
| L1-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
| PP |
2116 RC58% DK:4.45 |
0.1300 | 0.3050 |
| PP |
7628 RC46% DK:4.74 |
0.1960 | |
| L2-CU | Inner Copper 2OZ | 0.0700 |
1.17
(Core with Cu) |
| CORE |
Core DK:4.6 |
1.0300 | |
| L3-CU | Inner Copper 2OZ | 0.0700 | |
| PP |
7628 RC46% DK:4.74 |
0.1960 | 0.3050 |
| PP |
2116 RC58% DK:4.45 |
0.1300 | |
| L4-CU | Outer Base Copper 1.5OZ | 0.0525 |
0.0525
(Plating to 2OZ) |
Thickness after lamination: 1.89mm, tolerance: ±10%
Finished PCB Thickness: 1.99mm, tolerance: ±10%
Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.
