PCBWay多層層圧構造 - 基板クイック試作

4+6+4 HDI stackup Layer buildup/stackup reference

In the layer structure of a PCB board, there are several important concepts.
PP (Prepreg): Prepreg is a semi-cured sheet, also known as prepreg material, a thin sheet material that impregnated with resin and cured to an intermediate degree. It is mainly used as the bonding material and insulation material for inner conductive patterns of multilayer printed circuit boards. After being laminated with Prepreg, the semi-cured epoxy resin is squeezed out, begins to flow, and solidifies, bonding the multilayer circuit boards together and forming a reliable insulating layer. In the PCB industry, Prepreg can be likened to glue, used to bond several cores together using the lamination method to create multilayer boards.
PP Type:1080(3.1mil), 3313(4.2mil), 2116(5.4mil), 7628(7.7mil).

Core: Core is a rigid material with specific thickness and copper on both sides.
The pressing materials for multilayer boards mainly consist of Prepreg and Core.

The differences between the two are:
- Prepreg is a material used in PCBs, with a semi-solid texture similar to cardboard, while core is a rigid material similar to copper.
- Prepreg functions as both an adhesive and insulator, whereas core serves as the foundational material for PCBs, with entirely different functional roles.
- Prepreg can be flexible, while core cannot be bent.
- Prepreg is non-conductive, whereas core has copper layers on both sides, serving as the conductive medium for the printed circuit board.

In other special cases or Advanced PCBs (you need to choose "Customized Services and Advanced Options" and Custom stackup or Impedance control):
1. If you need custom stackup or control impedance, we will manufacture according to your requirement.
2. After place order,we will calculate whether it meets the requirements based on the stackup , material and impedance information.Also we will confirm with you.

For flexible PCB stackup, please check "Stack-up for FPC".

For rigid PCB, in response to customer demand, PCBWay has added a variety of laminate structures to our products (currently, we have added 298 and will continue to update them), which can greatly satisfy product structural design and impedance requirements.

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Encoder boards

Good quality

Engineer

Stepper motor & RS-485 driver

Everythings mounted properly and looks good. Very pleased that I got an image after first cards TH components where soldered so I could verify placement etc. All in all a very pleasant order

Pedersen

PCB standard stackup Total: 298

Layers

Please Select
4 Layers
6 Layers
8 Layers
10 Layers
12 Layers
14 Layers
16 Layers
18 Layers

Thickness (MM)

Please Select
0.4MM
0.6MM
0.8MM
1.0MM
1.2MM
1.6MM
2.0MM
2.4MM

Inner Copper (OZ)

Please Select
0.5OZ
1OZ
1.5OZ
2OZ
3OZ
4OZ
5OZ

Outer Copper (OZ)

Please Select
1OZ
2OZ
3OZ
4OZ
5OZ

Inner layer Residual copper ratio (%)

Please Select
90%
70%
50%
30%

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Friendly Reminder: This is a through-hole board stack-up, not applicable for blind and buried vias. PCBWay supports customers to customize structures, and will continue to increase the structure diagrams.

4 Layers Total: 112

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1 4-layers PCB Regular

Thickness: 1.6MM

Finished Outer Copper: 1OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 70%

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1855
L2-CU	Inner Copper 1OZ	0.0350	1.1 (Core with Cu)
CORE	Core DK:4.6	1.0300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1855
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.51mm, tolerance: ±10%

Finished PCB Thickness: 1.61mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 4-layers PCB Regular

Thickness: 1.6MM

Finished Outer Copper: 1OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 50%

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	1.1 (Core with Cu)
CORE	Core DK:4.6	1.0300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 4-layers PCB Regular

Thickness: 1.6MM

Finished Outer Copper: 1OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 30%

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1715
L2-CU	Inner Copper 1OZ	0.0350	1.1 (Core with Cu)
CORE	Core DK:4.6	1.0300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1715
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.48mm, tolerance: ±10%

Finished PCB Thickness: 1.58mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

4 4-layers PCB Regular

Thickness: 1.6MM

Finished Outer Copper: 2OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 70%

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1855
L2-CU	Inner Copper 1OZ	0.0350	1.0 (Core with Cu)
CORE	Core DK:4.6	0.9300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1855
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.48mm, tolerance: ±10%

Finished PCB Thickness: 1.58mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

5 4-layers PCB Regular

Thickness: 1.6MM

Finished Outer Copper: 2OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 50%

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	1.0 (Core with Cu)
CORE	Core DK:4.6	0.9300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.46mm, tolerance: ±10%

Finished PCB Thickness: 1.56mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

6 4-layers PCB Regular

Thickness: 1.6MM

Finished Outer Copper: 2OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 30%

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1715
L2-CU	Inner Copper 1OZ	0.0350	1.0 (Core with Cu)
CORE	Core DK:4.6	0.9300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1715
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.45mm, tolerance: ±10%

Finished PCB Thickness: 1.55mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1855
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1855
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 2OZ)

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 2OZ)

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1715
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1715
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 2OZ)

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 1.5OZ	0.0265	0.0265 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	2.0 (Core with Cu)
CORE	Core DK:4.6	1.9300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L4-CU	Outer Base Copper 1.5OZ	0.0265	0.0265 (Plating to 2OZ)

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2495
PP	2116 RC58% DK:4.45	0.1300
L2-CU	Inner Copper 3OZ	0.1050	0.8 (Core with Cu)
CORE	Core DK:4.6	0.5900
L3-CU	Inner Copper 3OZ	0.1050
PP	2116 RC58% DK:4.45	0.1300	0.2495
PP	2116 RC58% DK:4.45	0.1300
L4-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	7628 RC46% DK:4.74	0.1960	0.3815
PP	7628 RC46% DK:4.74	0.1960
L2-CU	Inner Copper 3OZ	0.1050	0.55 (Core with Cu)
CORE	Core DK:4.6	0.3400
L3-CU	Inner Copper 3OZ	0.1050
PP	7628 RC46% DK:4.74	0.1960	0.3815
PP	7628 RC46% DK:4.74	0.1960
L4-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

6 Layers Total: 74

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1 6-layers PCB Regular

Thickness: 1.6MM

Finished Outer Copper: 1OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 70%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L4-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.45mm, tolerance: ±10%

Finished PCB Thickness: 1.55mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 6-layers PCB Regular

Thickness: 1.6MM

Finished Outer Copper: 1OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 50%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L4-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.55mm, tolerance: ±10%

Finished PCB Thickness: 1.65mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 6-layers PCB Regular

Thickness: 1.6MM

Finished Outer Copper: 2OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 70%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.45mm, tolerance: ±10%

Finished PCB Thickness: 1.55mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

4 6-layers PCB Regular

Thickness: 1.6MM

Finished Outer Copper: 2OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 50%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.2250
PP	2116 RC58% DK:4.45	0.1300	0.2250
L4-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.56mm, tolerance: ±10%

Finished PCB Thickness: 1.66mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

5 6-layers PCB Regular

Thickness: 2.4MM

Finished Outer Copper: 1OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 70%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0925
L2-CU	Inner Copper 1OZ	0.0350	1.0 (Core with Cu)
CORE	Core DK:4.6	0.9300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L4-CU	Inner Copper 1OZ	0.0350	1.0 (Core with Cu)
CORE	Core DK:4.6	0.9300
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0925
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.40mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

6 6-layers PCB Regular

Thickness: 2.4MM

Finished Outer Copper: 1OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 50%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	0.9 (Core with Cu)
CORE	Core DK:4.6	0.8300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L4-CU	Inner Copper 1OZ	0.0350	0.9 (Core with Cu)
CORE	Core DK:4.6	0.8300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.35mm, tolerance: ±10%

Finished PCB Thickness: 2.45mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

8 Layers Total: 49

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1 8-layers PCB Regular

Thickness: 1.6MM

Finished Outer Copper: 1OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 70%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

CORE

L7-CU

L8-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L6-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L8-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.52mm, tolerance: ±10%

Finished PCB Thickness: 1.62mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 8-layers PCB Regular

Thickness: 1.6MM

Finished Outer Copper: 1OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 50%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

CORE

L7-CU

L8-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L6-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L8-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.48mm, tolerance: ±10%

Finished PCB Thickness: 1.58mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 8-layers PCB Regular

Thickness: 1.6MM

Finished Outer Copper: 2OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 70%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

CORE

L7-CU

L8-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L6-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.46mm, tolerance: ±10%

Finished PCB Thickness: 1.56mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

4 8-layers PCB Regular

Thickness: 1.6MM

Finished Outer Copper: 2OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 50%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

CORE

L7-CU

L8-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L6-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.55mm, tolerance: ±10%

Finished PCB Thickness: 1.65mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

5 8-layers PCB Regular

Thickness: 2.4MM

Finished Outer Copper: 1OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 70%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

CORE

L7-CU

L8-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.6 (Core with Cu)
CORE	Core DK:4.6	0.5300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.6 (Core with Cu)
CORE	Core DK:4.6	0.5300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L6-CU	Inner Copper 1OZ	0.0350	0.6 (Core with Cu)
CORE	Core DK:4.6	0.5300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L8-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.29mm, tolerance: ±10%

Finished PCB Thickness: 2.39mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

6 8-layers PCB Regular

Thickness: 2.4MM

Finished Outer Copper: 1OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 50%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

CORE

L7-CU

L8-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	0.6 (Core with Cu)
CORE	Core DK:4.6	0.5300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L4-CU	Inner Copper 1OZ	0.0350	0.6 (Core with Cu)
CORE	Core DK:4.6	0.5300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L6-CU	Inner Copper 1OZ	0.0350	0.6 (Core with Cu)
CORE	Core DK:4.6	0.5300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L8-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.25mm, tolerance: ±10%

Finished PCB Thickness: 2.35mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

10 Layers Total: 33

View all

1 10-layers PCB Regular

Thickness: 1.6MM

Finished Outer Copper: 1OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 70%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

CORE

L7-CU

L8-CU

CORE

L9-CU

L10-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0925
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0925
L10-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.55mm, tolerance: ±10%

Finished PCB Thickness: 1.65mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 10-layers PCB Regular

Thickness: 1.6MM

Finished Outer Copper: 1OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 50%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

CORE

L7-CU

L8-CU

CORE

L9-CU

L10-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0855
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0855
L10-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 10-layers PCB Regular

Thickness: 1.6MM

Finished Outer Copper: 1OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 30%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

CORE

L7-CU

L8-CU

CORE

L9-CU

L10-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L10-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

4 10-layers PCB Regular

Thickness: 2.4MM

Finished Outer Copper: 1OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 70%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

CORE

L7-CU

L8-CU

CORE

L9-CU

L10-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1855
L2-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L6-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L8-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L9-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1855
L10-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

5 10-layers PCB Regular

Thickness: 2.4MM

Finished Outer Copper: 1OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 50%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

CORE

L7-CU

L8-CU

CORE

L9-CU

L10-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L4-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L6-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L8-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L9-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L10-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.28mm, tolerance: ±10%

Finished PCB Thickness: 2.38mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

6 10-layers PCB Regular

Thickness: 2.4MM

Finished Outer Copper: 1OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 30%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

CORE

L7-CU

L8-CU

CORE

L9-CU

L10-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L4-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L6-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L8-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L10-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.29mm, tolerance: ±10%

Finished PCB Thickness: 2.39mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

12 Layers Total: 12

View all

1 12-layers PCB Regular

Thickness: 1.6MM

Finished Outer Copper: 1OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 70%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

CORE

L7-CU

L8-CU

CORE

L9-CU

L10-CU

CORE

L11-CU

L12-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0925
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L10-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L11-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0925
L12-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.55mm, tolerance: ±10%

Finished PCB Thickness: 1.65mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 12-layers PCB Regular

Thickness: 1.6MM

Finished Outer Copper: 1OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 50%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

CORE

L7-CU

L8-CU

CORE

L9-CU

L10-CU

CORE

L11-CU

L12-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0855
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L10-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L11-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0855
L12-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.48mm, tolerance: ±10%

Finished PCB Thickness: 1.58mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 12-layers PCB Regular

Thickness: 1.6MM

Finished Outer Copper: 1OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 30%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

CORE

L7-CU

L8-CU

CORE

L9-CU

L10-CU

CORE

L11-CU

L12-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0785
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L10-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L11-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0785
L12-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.52mm, tolerance: ±10%

Finished PCB Thickness: 1.62mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

4 12-layers PCB Regular

Thickness: 2.4MM

Finished Outer Copper: 1OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 70%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

CORE

L7-CU

L8-CU

CORE

L9-CU

L10-CU

CORE

L11-CU

L12-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1855
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L6-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L8-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L10-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L11-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1855
L12-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.34mm, tolerance: ±10%

Finished PCB Thickness: 2.44mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

5 12-layers PCB Regular

Thickness: 2.4MM

Finished Outer Copper: 1OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 50%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

CORE

L7-CU

L8-CU

CORE

L9-CU

L10-CU

CORE

L11-CU

L12-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L6-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L8-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L10-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L11-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L12-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.27mm, tolerance: ±10%

Finished PCB Thickness: 2.37mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

6 12-layers PCB Regular

Thickness: 2.4MM

Finished Outer Copper: 1OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 30%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

CORE

L7-CU

L8-CU

CORE

L9-CU

L10-CU

CORE

L11-CU

L12-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L6-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L8-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L9-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L10-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L12-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

7 12-layers PCB Regular

Thickness: 2.0MM

Finished Outer Copper: 1OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 70%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

CORE

L7-CU

L8-CU

CORE

L9-CU

L10-CU

CORE

L11-CU

L12-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0925
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L10-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L11-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0925
L12-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.92mm, tolerance: ±10%

Finished PCB Thickness: 2.02mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

8 12-layers PCB Regular

Thickness: 2.0MM

Finished Outer Copper: 1OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 50%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

CORE

L7-CU

L8-CU

CORE

L9-CU

L10-CU

CORE

L11-CU

L12-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L10-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L12-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.9mm, tolerance: ±10%

Finished PCB Thickness: 2.00mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

9 12-layers PCB Regular

Thickness: 1.2MM

Finished Outer Copper: 1OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 70%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

CORE

L7-CU

L8-CU

CORE

L9-CU

L10-CU

CORE

L11-CU

L12-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0925
L2-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0600
L4-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L5-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0600
L6-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L7-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0600
L8-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L9-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0600
L10-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L11-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0925
L12-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.14mm, tolerance: ±10%

Finished PCB Thickness: 1.24mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

10 12-layers PCB Regular

Thickness: 1.2MM

Finished Outer Copper: 1OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 50%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

CORE

L7-CU

L8-CU

CORE

L9-CU

L10-CU

CORE

L11-CU

L12-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.0635
L2-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L4-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L6-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L7-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L8-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L9-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L10-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L11-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0635
L12-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.11mm, tolerance: ±10%

Finished PCB Thickness: 1.21mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

11 12-layers PCB Regular

Thickness: 1.2MM

Finished Outer Copper: 1OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 30%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

CORE

L7-CU

L8-CU

CORE

L9-CU

L10-CU

CORE

L11-CU

L12-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0785
L2-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0540
L4-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0540
L6-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L7-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0540
L8-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L9-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0540
L10-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L11-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0785
L12-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.08mm, tolerance: ±10%

Finished PCB Thickness: 1.18mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

12 12-layers PCB

Thickness: 2.0MM

Finished Outer Copper: 1OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 30%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

CORE

L7-CU

L8-CU

CORE

L9-CU

L10-CU

CORE

L11-CU

L12-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0785
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.1840
PP	2116 RC58% DK:4.45	0.1300	0.1840
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.1840
PP	2116 RC58% DK:4.45	0.1300	0.1840
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1840
PP	3313 RC58% DK:4.45	0.1030	0.1840
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1840
PP	3313 RC58% DK:4.45	0.1030	0.1840
L10-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L11-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0785
L12-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.93mm, tolerance: ±10%

Finished PCB Thickness: 2.03mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

14 Layers Total: 6

View all

1 14-layers PCB Regular

Thickness: 2.4MM

Finished Outer Copper: 1OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 70%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

CORE

L7-CU

L8-CU

CORE

L9-CU

L10-CU

CORE

L11-CU

L12-CU

CORE

L13-CU

L14-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L6-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L8-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L10-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L12-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L13-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L14-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.26mm, tolerance: ±10%

Finished PCB Thickness: 2.35mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 14-layers PCB Regular

Thickness: 2.4MM

Finished Outer Copper: 1OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 50%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

CORE

L7-CU

L8-CU

CORE

L9-CU

L10-CU

CORE

L11-CU

L12-CU

CORE

L13-CU

L14-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.1935
PP	2116 RC58% DK:4.45	0.1300	0.1935
L2-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L4-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L6-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L8-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L10-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L12-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L13-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1935
PP	1080 RC68% DK:4.21	0.0810	0.1935
L14-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.34mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 14-layers PCB Regular

Thickness: 2.4MM

Finished Outer Copper: 1OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 30%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

CORE

L7-CU

L8-CU

CORE

L9-CU

L10-CU

CORE

L11-CU

L12-CU

CORE

L13-CU

L14-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2085
PP	2116 RC58% DK:4.45	0.1300	0.2085
L2-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L4-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L6-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L8-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L10-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L12-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L13-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.2085
PP	3313 RC58% DK:4.45	0.1030	0.2085
L14-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.39mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

4 14-layers PCB Regular

Thickness: 2.0MM

Finished Outer Copper: 1OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 70%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

CORE

L7-CU

L8-CU

CORE

L9-CU

L10-CU

CORE

L11-CU

L12-CU

CORE

L13-CU

L14-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0925
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L10-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L12-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L13-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0925
L14-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.97mm, tolerance: ±10%

Finished PCB Thickness: 2.07mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

5 14-layers PCB Regular

Thickness: 2.0MM

Finished Outer Copper: 1OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 50%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

CORE

L7-CU

L8-CU

CORE

L9-CU

L10-CU

CORE

L11-CU

L12-CU

CORE

L13-CU

L14-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L10-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L12-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L13-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L14-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.94mm, tolerance: ±10%

Finished PCB Thickness: 2.04mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

6 14-layers PCB Regular

Thickness: 2.0MM

Finished Outer Copper: 1OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 30%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

CORE

L7-CU

L8-CU

CORE

L9-CU

L10-CU

CORE

L11-CU

L12-CU

CORE

L13-CU

L14-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L10-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L12-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L13-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L14-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.85mm, tolerance: ±10%

Finished PCB Thickness: 1.95mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

16 Layers Total: 6

View all

1 16-layers PCB Regular

Thickness: 2.4MM

Finished Outer Copper: 1OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 70%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

CORE

L7-CU

L8-CU

CORE

L9-CU

L10-CU

CORE

L11-CU

L12-CU

CORE

L13-CU

L14-CU

CORE

L15-CU

L16-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L10-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L12-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L13-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L14-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L15-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L16-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 16-layers PCB Regular

Thickness: 2.4MM

Finished Outer Copper: 1OZ

Inner Copper: 1OZ

Inner layer Residual copper ratio: 50%

L1-CU

L2-CU

CORE

L3-CU

L4-CU

CORE

L5-CU

L6-CU

CORE

L7-CU

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)
PP	7628 RC46% DK:4.74	0.1960	0.3780
PP	7628 RC46% DK:4.74	0.1960	0.3780
L2-CU	Inner Copper 4OZ	0.1400	0.51 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 4OZ	0.1400
PP	7628 RC46% DK:4.74	0.1960	0.3780
PP	7628 RC46% DK:4.74	0.1960	0.3780
L4-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2885
PP	7628 RC46% DK:4.74	0.1960	0.2885
L2-CU	Inner Copper 1OZ	0.0350	1.6 (Core with Cu)
CORE	Core DK:4.6	1.5300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.2885
PP	3313 RC58% DK:4.45	0.1030	0.2885
L4-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)

Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 4.5OZ	0.1575	0.1575 (Plating to 5OZ)
PP	3313 RC58% DK:4.45	0.1070	0.2855
PP	7628 RC46% DK:4.74	0.1960	0.2855
L2-CU	Inner Copper 5OZ	0.1750	0.383 (Core with Cu)
CORE	Core DK:4.6	0.0330
L3-CU	Inner Copper 5OZ	0.1750
PP	3313 RC58% DK:4.45	0.1070	0.2680
PP	7628 RC46% DK:4.74	0.1960	0.2680
L4-CU	Inner Copper 5OZ	0.1750	0.383 (Core with Cu)
CORE	Core DK:4.6	0.0330
L5-CU	Inner Copper 5OZ	0.1750
PP	7628 RC46% DK:4.74	0.1960	0.2855
PP	3313 RC58% DK:4.45	0.1070	0.2855
L6-CU	Outer Base Copper 4.5OZ	0.1575	0.1575 (Plating to 5OZ)

4,6,8, ..., 18層のスタックアップ多層層圧構造

4+6+4 HDI stackup Layer buildup/stackup reference

基板製造基準

アセンブリ基準