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The 3rd-order 5G IoT HDI PCB is made of Shengyi S1000-2M material through 8 lamination, surface immersion gold and OSP and other processes. The HDI circuit board is widely used in the field of 5G Internet of Things.
12 layers, Material: S1000-2M, Thickness: 1.2±0.1mm
14 layers, Thickness: 1.6±0.16, Surface Finish: OSP
12 layers, Material: S1000-2M, Thickness: 1.8±0.18m
8 layers, Material: S1000-2M, Thickness: 4.4±0.4mm
8 layers, Material: S1000-2M, Thickness: 1.2±0.1mm
10 layers, Material: S1000-2M, Thickness: 1.3±0.13mm
14 layers, Material: S1000-2M, Thickness: 1.6±0.1mm
10 layers, Material: S1000-2M, Thickness: 2.2±0.2mm
8 layers, Material: A1000-2M, Thickness: 2.5±0.25mm
8 layers, Material: R5775G+IT180, Thickness: 2.0±0.2mm
18 layers, Material: RO4350B+TU872SLK Rogers, Thickness: 3.2±0.32mm
22 layers, Material: TU-883, Thickness: 1.6±0.16mm
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