Holidays Notice: We expect to have holidays from Feb 6-Feb 18 for Chinese holidays. You can place orders online as usual, but the production and delivery date will be postponed by 13days, please arrange your production plan appropriately.

基板クイック試作

カスタム基板試作サービス


PCB Via Covering

Vias not covered

It means that the vias are exposed and the surface finish is applied to via barrel.

The solder paste might get into the vias and cause poor or non-existent solder joints.

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Tenting vias

It means that the vias are simply covering by soldermask ink.No additional process steps is required during fabrication.

Covering the annular ring and vias with soldermask ink in order to prevent exposure to the elements and reduce accidental shorting or contact with the circuit.

image.png

Plugged Vias with non conductive media (eg. Epoxy/resin, soldermask ink)

The conductive vias in BGA requires plugged vias. Because solder paste might wick away from the intended pad and flow down into the via, then creating poor or non-existent solder joints during assembly.

The diameter of the plugged vias requires to be smaller than 0.5mm.


soldermask ink:

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Epoxy/resin:

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