Pick and place file or XYRS data file (Pick-n-place, component locator, or X, Y, rotation, side data – Centroid of parts)


PCBアセンブリでは、PCBAの作業を開始するためにいくつかのファイルが必要となりますが、次のファイルを適切な形式でお送りください。 注文番号を参照して電子メールで送信し service25@pcbway.com 電子メールの件名を「注文番号123456のファイル」と入力します。


ボードの組み立てに必要な部品と、それらの部品の配置と組み立ての場所を示していますBOMは、.xls、xlsx、または.csvの形式で受け入れます。 ターンキー注文および部分ターンキー注文のBOMは、受託品/キット注文のBOMよりもさらに多くの情報を要求する場合があります。

  • 行#
  • 部品番号あたりの数量
  • 参照指定子
  • 品番
  • 部品の説明
  • パッケージ
  • タイプ(表面実装, Thru-hole or Hybrid)
  • 行#
  • 部品番号あたりの数量
  • 参照指定子
  • 品番
  • 部品の説明
  • パッケージ
  • タイプ(表面実装, Thru-hole or Hybrid)
  • メーカー名
  • メーカー品番
  • 販売代理店の部品番号
クリックしてダウンロード BOMのサンプル


ボードの組み立てには、RS-274X形式のPCB製作用の同じGerberファイルが必要になりますプリント基板アセンブラには、シルクスクリーン、銅(トラック)、はんだペーストの3層のファイルが必要です。 もちろん、アセンブリが始まる前にすべての情報が完全で正確なものであることを確認するために、これらのファイルがすべて含まれているかどうかを確認してください。

Centroid ァイル

Centroidは、アセンブリマシンをすばやくプログラミングするために使用されるアセンブリ用の特殊ファイルで、別名Insertion、Pick-N-Place、またはXY Dataとも呼ばれます。 Centroidファイルには、すべての表面実装部品の位置と方向が記述されており、参照指定子、XとYの位置、回転とボードの側面(上または下)のみが含まれています。 表面実装部品はセントロイドに記載されています。

クリックしてダウンロード Centroid Fileのサンプル


プリント基板を正しく組み立てるために、組み立て図、特別な組み立て説明書、さらには作品の写真や写真を含む、ボードに関連する他のすべての文書や情報をお送りください。 情報は私達があなたの組み立ての必要性をよりよく理解するのを助け、いくつかのあいまいなあるいは誤った配置さえも修正しそして最終的には素晴らしい仕事になってしまいます。




quotesI am impressed with the quality of the boards, the delivery time and responce to all my questions. Best price excellent service and speedy delivery. When I need another board I will certainly use this supplier. "

-Bill Robinson Company


-FVL. SKU Company
Front-end data preparation

01.PPE - Pre Production Engineering

Customer supplied data (gerber) is used to produce the manufacturing data for the specific PCB (artworks for imaging processes and drill data for drilling programs). Engineers compare demands/specifications against capabilities to ensure compliance and also determine the process steps and associated checks. No changes are allowed without PCBWay Group permission.


02.Preparing the phototools

Artwork Master is PCB production in the key steps, which directly affect the quality of the final product quality,An accurately scaled configuration of electronic data used to produce the artwork master or production master. Artwork Master – The photographic image of the PCB pattern on film used to produce the circuit board, usually on a 1:1 scale.In general, there are three types of Artwork Master:(1) Conductive Pattern  (2) solder mask (3) Silkscreen

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03.Print inner layers

Stage 1 is to transfer the image using an artwork film to the board surface, using photosensitive dry-film and UV light, which will polymerise the dry film exposed by the artwork.
This step of the process is performed in a clean room.
Imaging – The process of transferring electronic data to the photo-plotter, which in turn uses light to transfer a negative image circuitry pattern onto the panel or film.

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04.Etch inner layers

Stage 2 is to remove the unwanted copper from the panel using etching. Once this copper has been removed, the remaining dry film is then removed leaving behind the copper circuitry that matches the design.
Etching – The chemical, or chemical and electrolytic, removal of unwanted portions of conductive or resistive material.

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05.Inner layer Automatic Optical Inspection(AOI)

Inspection of the circuitry against digital “images” to verify that the circuitry matches the design and that it is free from defects. Achieved through scanning of the board and then trained inspectors will verify any anomalies that the scanning process has highlighted. PCBWay Group allows no repair of open circuits.

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06.Lay-up and bond (Lamination)

The inner layers have an oxide layer applied and then “stacked” together with pre-preg providing insulation between layers and copper foil is added to the top and bottom of the stack. The lamination process consists of placing the internal layers under extreme temperature (375 degrees Fahrenheit) and pressure (275 to 400 psi) while laminating with a photosensitive dry resist. The PCB is allowed to cure at a high temperature, the pressure is slowly released and then the material is slowly cooled.

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07.Drilling the PCB

We now have to drill the holes that will subsequently create electrical connections within the multilayer PCB. This is a mechanical drilling process that must be optimised so that we can achieve registration to all of the the inner layer connections. The panels can be stacked at this process. The drilling can also be done by a laser drill

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08.Electroless copper deposition

The first step in the plating process is the chemical deposition of a very thin layer of copper on the hole walls.
PTH provides a very thin deposit of copper that covers the hole wall and the complete panel. A complex chemical process that must be strictly controlled to allow a reliable deposit of copper to be plated even onto the non-metallic hole wall. Whilst not a sufficient amount of copper on its own, we now have electrical continuity between layers and through the holes.Panel plating follows on from PTH to provide a thicker deposit of copper on top of the PTH deposit – typically 5 to 8 um. The combination is used to optimise the amount of copper that is to be plated and etched in order to achieve the track and gap demands.

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09.Image the outer layers

Similar to the inner layer process (image transfer using photosensitive dry film, exposure to UV light and etching), but with one main difference – we will remove the dry film where we want to keep the copper/define circuitry – so we can plate additional copper later in the process.
This step of the process is performed in a clean room.

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Second electrolytic plating stage, where the additional plating is deposited in areas without dry film (circuitry). Once the copper has been plated, tin is applied to protect the plated copper.

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11.Etch outer layer

This is normally a three step process. The first step is to remove the blue dry film. The second step is to etch away the exposed/unwanted copper whilst the tin deposit acts an etch resist protecting the copper we need. The third and final step is to chemically remove the tin deposit leaving the circuitry.


12.Outer layer AOI

Just like with inner layer AOI the imaged and etched panel is scanned to make sure that the circuitry meets design and that it is free from defects. Again no repair of open circuits are allowed under PCBWay demands.



Soldermask ink is applied over the whole PCB surface. Using artworks and UV light we expose certain areas to the UV and those areas not exposed are removed during the chemical development process – typically the areas which are to be used as solderable surfaces. The remaining soldermask is then fully cured making it a resilient finish.
This step of the process is performed in a clean room.

Surface finish

14.Surface finish

Various finishes are then applied to the exposed copper areas. This is to enable protection of the surface and good solderability. The various finishes can include Electroless Nickel Immersion Gold, HASL, Immersion Silver etc. Thicknesses and solderability tests are always carried out.



This is the process of cutting the manufac-turing panels into specific sizes and shapes based upon the customer design as defined within the gerber data. There are 3 main options available when providing the array or selling panel – scoring, routing or punching. All dimensions are measured against the customer supplied drawing to ensure the panel is dimensionally correct.

Electrical test

16.Electrical test

Used for checking the integrity of the tracks and the through hole interconnections – checking to ensure there are no open circuits or no short circuits on the finished board. There are two test methods, flying probe for smaller volumes and fixture based for volumes.We electrically test every multilayer PCB against the original board data. Using a flying probe tester we check each net to ensure that it is complete (no open circuits) and does not short to any other net.


17.Final inspection

In the last step of the process a team of sharp-eyed inspectors give each PCB a final careful check-over.Visual checking the PCB against acceptance criteria and using PCBWay “approved” inspectors. Using manual visual inspection and AVI – compares PCB to gerber and has a faster checking speed that human eyes, but still requires human verification. All orders are also subjected to a full inspection including dimensional, solderability, etc.



Boards are wrapped using materials that comply with the PCBWay Packaging demands (ESD etcetera) and then boxed prior to be being shipped using the requested mode of transport.