1.Up to 64 layer processing technology, the minimum trace and space is 2.5 / 2.5mil, the highest ratio of board thickness and hole diameter is 16:1.
2. Long and short gold finger processing technology and high-density trace’s precision control to meet the design requirements of photoelectric communication products.
3. High-precision back-drilling technology to reduce the equivalent series inductance of vias and in case to meet the product’s integrity requirements of signal transmission;
4. Advanced metal-based and ultra-thick copper manufacturing process to meet the high heat dissipation requirements of power products.
5. High-precision mechanical and laser depth control technology to achieve multi-level step groove product’s structure and meet the different levels of assembly requirements.
6. The mature mixed pressure process realizes the mixing of FR-4 and high-frequency materials, and saves the material cost for customers under the premise of achieving the high-frequency performance of the products.
7. Advanced Anti-CAF process technology greatly improves the reliability and service life of PCB products.
8. Advanced buried capacitor and buried resistor technology greatly improve the performance of PCB products.
9. Advanced inner layer exposed technology meets the information transmission requirements of high frequency circuits.
1. UL certification.
2. ISO9001:2008 quality certification.
3. ISO/TS1694:2009 certification.
4. Strictly manage the processing of customized products according to IPC6012 II /III/customer standard/enterprise internal standard.
5. Strict management for customer information confidentiality.
1.Orbotech AOI (automatic optical inspection) machine imported from Israel for detecting high-precision circuits.
2.The high-precision impedance tester imported from the United States meets the impedance test requirement.
3. PLASMA plasma processing equipment, used for hole wall degumming of PTFE, ceramic fillers and other high-frequency material.
4. Ende CNC drilling machine imported from Taiwan for back drilling and deep hole control.
5. Orbotech LDI machine (laser direct imaging) imported from Israel for graphic transfer of high-precision circuits.
6. Ende CNC numerical control molding machine imported from Taiwan, used for deep-groove milling of stepped groove structure products.
7. BURKLE lamination imported from Germany for multi-layer boards pressing.
8. Vacuum resin plugging machine for hole plug in BGA panel of ultra high-precision circuits.
9. Ion staining tester, anti-stripping strength tester, hole copper tester, secondary element tester, copper thickness tester and other reliability testing equipment to ensure product quality.
1. PCB substrate materials: Select the top brands in the industry: Shengyi, ROGERS, ARLON, TACONIC, 3M, Omega, etc.
2. Auxiliary materials: Rohm and Haas electroplating syrup, Hitachi dry film, Taiyo ink, Noda resin, etc.
1. Efficient service
1 minute to respond to customers, 1H to reply results, 1 day to solve problems, 1 week to complete service.
2. Fast delivery (work day,China Time Zone(GMT+8))
I am impressed with the quality of the boards, the delivery time and responce to all my questions. Best price excellent service and speedy delivery. When I need another board I will certainly use this supplier. "-Bill Robinson Company
спасибо за платы! платы очень хорошего качества. надежный продавец. оперативно отвечал на вопросы. заказ выполнили и отправили очень быстро.Заказываю платы не в первый раз - как всегда только лучшие впечатления. 5+++. 4 числа отправил файлы 26-го забрал на почте в Москве."-FVL. SKU Company