7th-order arbitrary interconnection HDI buried/blind via circuit board

基板製品 / HDI PCB / 7th-order arbitrary interconnection HDI buried/blind via circuit board

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Applications

High-end smartphones, etc

Features

Material

S1000-2M

Layers

16 Layers

Thickness

1.8±0.13mm

Min Hole Size

Laser hole 0.1mm

Min Track/Spacingh

75/75um

Minimum board thickness and hole ratio

Surface Finish

Immersion gold(ENIG) 2u"

今すぐお見積もり

製品詳細

The "7th generation HDI (High Density Interconnect) PCB circuit board with arbitrary interconnections" is one of the series of 7th generation HDI PCB circuit boards developed and manufactured by PCBWay. This particular 7th generation HDI circuit board is fabricated using Shengyi S1000-2M material and undergoes multiple processes such as laser drilling and lamination. The 7th generation HDI board finds extensive applications in high-end smartphones and other similar industries.

基板製造基準

優品基板のケーパビリティ

多層層圧構造

クイックターン基板製作

基板試作

少量生産

生産工程

基板製品

基板のよくある質問

アセンブリ基準

PCB実装能力

特別なお知らせ

ファイル必要条件

PCBアセンブリFAQ

生産工程

PCBアセンブリ製品

お問い合わせ!

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FENIX v0.5

Excellent service, support with file queries, appropriate solutions that facilitate development work. We are very grateful for the attention given to this and other projects manufactured with PCBWay.

C.A.

Placa de comando

After manufacturing the board correctly, the team contacted me with an assembled prototype to confirm the assembly method. I thought that was amazing. After confirming my part of the assembly, the team proceeded with the production process and assembled the boards in a very professional manner. Congratulations!

Engineer

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