
The 5G mobile phone PCB motherboard is made of Shengyi S1000-2M material through surface immersion gold, laser drilling and OSP processes. This type of HDI circuit board is widely used in the field of smart phones.
4 layers, Thickness: 1.12mm, Surface Finish: HASL lead free
2 layers, Thickness: 1.2mm
2 layers, Thickness: 1.6mm, Surface Finish: Immersion gold(ENIG)
6 layers, Thickness: 1.6mm, Surface Finish: Immersion gold(ENIG)
6 layers, Thickness: 2.6mm, Size: 6*6cm
10 layers, Material: FR4, Thickness: 1.6mm
6 layers, Thickness: 1.0mm, Surface Finish: Immersion gold(ENIG) 3U"
12 layers, Material: FR4, Thickness: 1.6mm
4 layers, Thickness: 0.8mm, Surface Finish: Immersion gold(ENIG)
6 layers, Thickness: 1.6mm, Surface Finish: Immersion gold(ENIG)
8 layers, Material: S1000-2M, Thickness: 1.0±0.1mm
4 layers, Material: RO4350B+TU768, Thickness: 1.6mm
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I would like to thank PCBWay for the professionalism and dedication shown in my project. The boards arrived with impeccable quality, precise soldering, and excellent electrical reliability. The entire process, from manufacturing to assembly, was carried out efficiently and in an organized manner. It is great to count on a company that combines cutting-edge technology with attention to detail.
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