基板クイック試作
カスタム基板試作サービス
基板クイック試作
カスタム基板試作サービス
The highest 16-layer Rigid-flex PCB processing technology
Surface Finish: ENIG + Silver Paste, Structure:1+2F+1
Surface Finish:Immersion gold, Structure:1+2F+1
Rigid-Flex Thickness: 0.295 +/- 0.052mm, Structure:1+2F+1
4 layers, Structure:(1+2F+1) HDI
4 layered HDI with Buried holes, Structure:1-{(2)}-1
0.6mm total thickness, Structure:1-2F-1
8 layers, Structure:(2+1+2F+1+2) HDI
6 layers, Structure:1+1+2F+1+1
2 layers, Material: PI, silver film, Thickness: 0.1mm
7 layers, Material: PI, FR-4, Thickness: 0.45mm
4 layers, Material: PI, FR-4, Thickness: 1.6mm
10 layers, Material: PI, FR-4, Grosor: 2.0mm
12 layers, Material: PI, FR-4, Thickness: 1.6mm
4 layers, Material: PI, Thickness: 0.2mm
4 layers, Material: PI, Thickness: 0.8mm
8 layers, Surface Finish: HASL
6 layers, Surface Finish: immersion gold
6 layers, Surface Finish: immersion gold
12 layers, Surface Finish: immersion gold
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私達のカスタマーサービス+86-571-85317532
A very, very easy build, and the finished device works perfectly. Note that my photos show a previous generation of the 3D printed case which required a bit of manual trimming around the amp module.
Phil Atkin
Of the 18 boards populated, 1 failed to operate, 1 had issues. The other 16 were operational. The process was pretty seamless - a few issues from my end regarding BOM descriptions, but otherwise all good. I will probably look at some advanced verification next time to ensure better yield rates.
Lucinsky
