PCB circuit board production in the copper surface is not rough copper surface roughness analysis of the problems may have about several reasons:
A former process problems, PTH process during which the impurities are mixed with the other:
1, activation of components disorders palladium salt concentration is too high or prepreg plate surface residues
2, the speed of the offset plate surface is residual tin copper ions
3, the chemical imbalance copper sink copper plate surface uneven
4, the copper plate surface before pickling improper residual impurities
Second, the problem of the black hole in the process, not the net result in micro carbon residue corrosion, oxidation improper bad board, drying caused by bad microetch unable to board the carbon stripping cause carbon residue, improper input and output current poor board .
Third, the copper tank itself with the question:
An anode issues: improper ingredients produced impurities
2, gloss agent problem (decomposition)
3, the current density is uneven copper surface due to improper
4, bath composition disorder or impurity contamination
5, the device due to improper design or assembly of the current distribution bad.
This situation produces copper are generally coarse problem itself, the second is to be brought into the sources. Thus, please be careful when operating staff, try to make copper flat, or affect the subsequent step process.
